Wednesday, December 1, 2010

[G737.Ebook] Download Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

Download Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

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Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant



Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

Download Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

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Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.

  • Sales Rank: #2576389 in Books
  • Published on: 2014-03-17
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.10" h x .90" w x 6.30" l, 1.25 pounds
  • Binding: Hardcover
  • 261 pages

About the Author
Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S in electrical engineering from UCLA.

Most helpful customer reviews

0 of 1 people found the following review helpful.
A VERY UNIQUE RESOURCE!!
By COSMIC TRAVELER
Are you a professional with a background in basic electrical circuit theory and electromagnetics? If you are, then this book is for you. Author Rick Sturdivant, has done an outstanding job of writing a book that presents the electronic packaging issues that are unique to microwave and millimeter-wave frequencies; and, reviews general electronic packaging techniques for how they can be tailored to higher frequency designs.

Author Sturdivant, begins with an introduction to the topic of packaging at microwave and millimeter-wave frequencies. Next, the author addresses materials issues that are of particular interest for high-frequency package designs. Then, he focuses on ceramics for packaging. In addition, the author presents laminate-based packaging, which is very attractive for low-cost, high-volume products. He continues by focusing on the electrical modeling of wire bonds and flip chip interconnects. Next, the author discusses second-level packaging, which includes quad flat no-lead packages, leadless chip carriers, and packages with leads and soldier bump packages. Then, he discusses microelectronic modules and motherboards, which must have properly designed transmission lines to interconnect between integrated circuits. In addition, the author focuses on transitions between signal transport structures, such as transmission lines and 3D packaging interconnects. He continues by reviewing the heat transfer mechanisms; and, then provides details on high-power amplifier thermal modeling, with the goal of maintaining device junction temperatures to ensure reliability. Next, the author addresses electrical design from the perspective of using electromagnetic design tools that have been commercialized during the past 20 years. Finally, he discusses some of the new horizons in electronic packaging, including chip scale packaging, MEMS etching techniques, and new 3D material fabrication techniques.

Throughout this most excellent book, dimensions are given in units of meters, except in the rare case where industry standards require the use of other units. Also, this great book shows how electromagnetic simulations were conducted, by using the High Frequency Structure Simulator from ANSYS, Inc.

See all 1 customer reviews...

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